Printhead assembly having improved adhesive bond strength

Details Printhead assembly having improved adhesive bond strength Printhead assembly having improved adhesive bond strength

2008-09-16

2008-09-16

Luu, Matthew (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S042000, C347S044000, C347S047000, C347S059000, C347S065000

Reexamination Certificate

active

11066158

ABSTRACT:
A printhead assembly is provided. The printhead assembly comprises (a) a plurality of printhead integrated circuits comprising; and (b) an ink manifold having a mounting surface, the backside of each printhead integrated circuit being bonded to the mounting surface with an adhesive. Each printhead integrated circuit comprises a plurality of nozzles formed on a front side of the printhead integrated circuit; a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and a plurality of etched trenches defined in the backside. The adhesive is received, at least partially, in the plurality of etched trenches, thereby increasing the adhesive bond strength whilst avoiding surface roughening of the printhead integrated circuits.

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