Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-01-29
2008-01-29
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23088, C257SE23099, C257S721000, C257S722000, C257S713000, C257S717000, C257S720000, C257S690000, C257S694000, C257S695000, C257S697000
Reexamination Certificate
active
11292564
ABSTRACT:
The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connected to a top portion of the thermal substrate, and a bending part which is bended and extended upward away from the thermal substrate. A plurality of sets of heat fins connecting to end portions of the bending part of the heat conductive pipe are supported and elevated by the heat conductive pipe so that an air space is formed between the thermal substrate and the sets of heat fins. A fan locating on a top part of the heat fins, wherein a plurality of air passages are formed in between those heat fins so that cool air ventilates from the fan through the air passages of the heat fins to the thermal substrate.
REFERENCES:
patent: 6502405 (2003-01-01), Van Winkle
patent: 7021368 (2006-04-01), Lin et al.
patent: 7032389 (2006-04-01), Cauchy
patent: 7059391 (2006-06-01), Whitney
patent: 2005/0098304 (2005-05-01), Lin et al.
patent: 2005/0207115 (2005-09-01), Barsun et al.
patent: 2006/0096741 (2006-05-01), Hegde
patent: 2006/0146499 (2006-07-01), Reents
Schmeiser Olsen & Watts
Thermaltake Technology Co., Ltd.
Williams Alexander Oscar
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