Semiconductor device package utilizing proud interconnect...

Details Semiconductor device package utilizing proud interconnect... Semiconductor device package utilizing proud interconnect...

2008-01-01

2008-01-01

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000

Reexamination Certificate

active

10970557

ABSTRACT:
A semiconductor package which includes a conductive can, a semiconductor die received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure formed on the other side of the semiconductor die, and a passivation layer disposed on the other side of the semiconductor die around the interconnect structure and extending at least to the can.

REFERENCES:
patent: 6889433 (2005-05-01), Enomoto et al.
patent: 7159313 (2007-01-01), Sathe et al.
patent: 2002/0005247 (2002-01-01), Graham et al.
patent: 2002/0114726 (2002-08-01), Soga et al.
patent: 2002/0155642 (2002-10-01), Noquil et al.
U.S. Appl. No. 10/970,165, filed Oct. 21, 2004.

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