Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-22
2008-04-22
Kim, Paul D (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S592100, C029S609100, C310S309000, C310S311000, C310S334000, C310S335000, C310S348000
Reexamination Certificate
active
09901869
ABSTRACT:
The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isolates elements of array transducers. Post processing of wafers consisting of transducers only on the top few microns of the wafer surface can be used to create a wafer scale packaging solution. By spinning or otherwise depositing polymeric and metallic thin and thick films, and by lithographically defining apertures and patterns on such films, transducers can be fully packaged prior to the final dicing steps that would separate the packaged transducers from each other. In the case of microfabricated ultrasonic transducers, such packaging layers can also enable flexible transducers and eliminate or curtail the acoustic cross-coupling that can occur between array elements.
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Kim Paul D
Siemens Medical Solutions USA , Inc.
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