Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-05-06
2008-05-06
Mis, David (Department: 2817)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S114000
Reexamination Certificate
active
11227190
ABSTRACT:
The present invention provides a semiconductor device having a plurality of functions and a method for manufacturing the semiconductor device. The semiconductor device comprises a thin film integrated circuit, a first substrate having a sensor or an antenna, and a second substrate having an antenna, wherein the thin film integrated circuit is interposed between the first substrate having a sensor or an antenna and the second substrate having an antenna. In the case that the semiconductor device has a plurality of antennas and the semiconductor device communicates in different frequency bands, the semiconductor device can receive a plurality of frequency bands, and so the range of choice of the reader/writer is expanded. In the case that the semiconductor device has a sensor and an antenna, information detected by the sensor can be converted to signals and the signals can be output to a reader/writer via the antenna. Therefore, the semiconductor device is added with higher value than that of the conventional semiconductor device such as a wireless chip.
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Mis David
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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