Method of testing a semiconductor chip and jig used in the...

Details Method of testing a semiconductor chip and jig used in the... Method of testing a semiconductor chip and jig used in the...

2008-01-29

2008-01-29

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11420205

ABSTRACT:
A method of and testing jig for sequentially testing front and rear surfaces of a semiconductor chip is shown. The testing jig includes a support package having a first cavity over which the semiconductor chip mounts; an infrared filter affixed relative to the first cavity and attached to a rear surface of the semiconductor chip; and a test substrate having a second cavity exposing the infrared filter and upon which the support package mounts. Front and rear surfaces of the semiconductor chip can be conveniently and sequentially tested. Because the testing jig includes the infrared filter and the heat pad, heat can be easily transmitted to the defective chip.

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English language abstract of Japanese Publication No. 05-240700.

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