Surface mount semiconductor device

Details Surface mount semiconductor device Surface mount semiconductor device

1996-08-27

1997-06-03

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, 257723, 257724, 257730, H01L 2328

Patent

active

056357605

ABSTRACT:
A semiconductor device of the present invention includes a plurality of lead terminals extending from only one side surface of a package main body having major surfaces and side surfaces, the lead terminal extending parallel to the major surface by a predetermined size and being substantially perpendicularly bent to project from the major surface by a predetermined size in a vertical mount type semiconductor device, or being substantially perpendicularly bent to project from the major surface by a predetermined size and bent again at a distal end portion in parallel to the major surface in a horizontal mount type semiconductor device, and a supporting means projecting from the package main body by substantially the same size as the projecting size of the lead terminals. A method of manufacturing the semiconductor device of the present invention includes the steps of lead frame formation, chip mounting and bonding, mold sealing, and lead terminal formation.

REFERENCES:
patent: 5309020 (1994-05-01), Murasawa et al.

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