System for fabricating corrugated board

Details System for fabricating corrugated board System for fabricating corrugated board

2008-09-16

2008-09-16

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S358000, C156S359000, C156S360000, C156S361000, C156S367000, C156S378000, C156S379000

Reexamination Certificate

active

10502643

ABSTRACT:
A system for fabricating a corrugated board sheet fabricated includes warp status information obtaining means (6, 6A-6H,7, 7A,7B,8, 8A-8H,240a,240b,241a,241b) for obtaining warp status information concerning status of the warp of the corrugated board sheet fabricated by a corrugated-board fabrication machine (1); running-state information obtaining means (5, 5A-5H) for obtaining running state information concerning a running state of the corrugated-board fabrication machine (1); control variable calculating means (4, 4A-4H) for calculating a control variable of a particular control factor that affects the warp of the corrugated board sheet and that is one among control factors used to control the corrugated-board fabrication machine (1) based on the warp status information of the corrugated board sheet and the running state information of the corrugated-board fabrication machine (1); and control means (5, 5A-5H) for controlling the particular control factor using the control variable calculated by the control variable calculating means (4, 4A-4H).

REFERENCES:
patent: 3981758 (1976-09-01), Thayer et al.
patent: 4134781 (1979-01-01), Carstens et al.
patent: 4314868 (1982-02-01), Hirakawa et al.
patent: 4497027 (1985-01-01), McGuire et al.
patent: 4556444 (1985-12-01), Schommler
patent: 5298121 (1994-03-01), Kilmister et al.
patent: 5788803 (1998-08-01), Sissons et al.
patent: 5837974 (1998-11-01), Sissons et al.
patent: 5915295 (1999-06-01), Lauderbaugh
patent: 6068701 (2000-05-01), Kohler et al.
patent: 6136417 (2000-10-01), Ishibuchi et al.
patent: 0536518 (1993-04-01), None
patent: 49-35239 (1974-09-01), None
patent: 51-53995 (1976-05-01), None
patent: SHO 54-1189 (1979-01-01), None
patent: 60-61246 (1985-04-01), None
patent: 1-86523 (1989-06-01), None
patent: 1-86524 (1989-06-01), None
patent: HEI 1-86523 (1989-06-01), None
patent: HEI 1-86524 (1989-06-01), None
patent: 1-274009 (1989-11-01), None
patent: 1-316257 (1989-12-01), None
patent: 4-59234 (1992-02-01), None
patent: 4-243769 (1992-08-01), None
patent: 5-96668 (1993-04-01), None
patent: 5-116802 (1993-05-01), None
patent: 6-55675 (1994-03-01), None
patent: 6-82237 (1994-03-01), None
patent: 6-114977 (1994-04-01), None
patent: 9-131814 (1997-05-01), None
patent: 10-128881 (1998-05-01), None
patent: 11-216786 (1999-08-01), None
patent: 11-221870 (1999-08-01), None
patent: 2000-20673 (2000-01-01), None
patent: 2000-225658 (2000-08-01), None
patent: 2000-280379 (2000-10-01), None
Notification dated Jul. 21, 2005 in relation to Japanese Patent Application No. 2002-070678..
Notice of Reasons for Rejection dated Jan. 18, 2005 with translation (JP Appln. No. 2002-030062).
Decision of Refusal for Appln. No. 2002-076332 dated Oct. 4, 2006, along with English Abstract and the reference cited therein.
Igarashi Seiichi, “Danbouru Housou Gijutsu”, first edition, issued by Nippo Co., Ltd., Sep. 2000, pp. 367-368.
English Translation of Notice of Rejection of Mar. 26, 2007 corresponding to (JP Appln. No. 2002-065937).
English Translation of Decision of Rejection of Oct. 4, 2006 corresponding to (JP Appln. No. 2002-076332).
English Translation of Notice of Rejection of Jul. 6, 2006 corresponding to (JP Appln. No. 2002-028699).
English Translation of Notice of Rejection of Jul. 6, 2006 corresponding to (JP Appln. No. 2002-070678).
English Translation of Notice of Rejection of Jul. 6, 2006 corresponding to (JP Appln. No. 2002-074620).
English Translation of Notice of Rejection of Jul. 4, 2006 corresponding to (JP Appln. No. 2002-065937).
English Translation of Notice of Rejection of Jul. 4, 2006 corresponding to (JP Appln. No. 2002-068473).
English Translation of Notice of Rejection of Jul. 7, 2006 corresponds to (JP Appln. No. 2002-076332).
Decision of Rejection for JP2002-065937, dated Apr. 8, 2008.

Affiliated with

Also associated with

Rating

System for fabricating corrugated board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for fabricating corrugated board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for fabricating corrugated board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3934657