System for testing semiconductor components

Details System for testing semiconductor components System for testing semiconductor components

2008-03-11

2008-03-11

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11516342

ABSTRACT:
A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The system can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

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