Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2008-04-22
2008-04-22
Hendricks, Keith D. (Department: 1794)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S220000, C428S615000, C228S245000, C228S249000, C228S252000
Reexamination Certificate
active
10844816
ABSTRACT:
Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
REFERENCES:
patent: 3615277 (1971-10-01), Kreider et al.
patent: 3705373 (1972-12-01), Cameron
patent: 3710473 (1973-01-01), McElwain et al.
patent: 3729046 (1973-04-01), Kennedy et al.
patent: 4186245 (1980-01-01), Gilman
patent: 4454379 (1984-06-01), Cleveland et al.
patent: 4778649 (1988-10-01), Niino et al.
patent: 4836982 (1989-06-01), Brupbacher et al.
patent: 4889745 (1989-12-01), Sata
patent: 4909842 (1990-03-01), Dunmead et al.
patent: 4990180 (1991-02-01), Halverson et al.
patent: 5001019 (1991-03-01), Ito et al.
patent: 5062025 (1991-10-01), Verhoeven et al.
patent: 5093148 (1992-03-01), Christodoulou et al.
patent: 5217816 (1993-06-01), Brupbacher et al.
patent: 5251803 (1993-10-01), Kashiba et al.
patent: 5266132 (1993-11-01), Danen et al.
patent: 5381944 (1995-01-01), Makowiecki et al.
patent: 5490911 (1996-02-01), Makowiecki et al.
patent: 5491003 (1996-02-01), Akahira
patent: 5503703 (1996-04-01), Dahotre et al.
patent: 5527442 (1996-06-01), Sekhar et al.
patent: 5538795 (1996-07-01), Barbee, Jr. et al.
patent: 5606146 (1997-02-01), Danen et al.
patent: 5773748 (1998-06-01), Makowiecki et al.
patent: 5786129 (1998-07-01), Ellis
patent: 5913256 (1999-06-01), Lowden et al.
patent: 6203892 (2001-03-01), Matsumura et al.
patent: 6203897 (2001-03-01), Koizumi et al.
patent: 6596101 (2003-07-01), Weihs et al.
patent: 6863992 (2005-03-01), Weihs et al.
patent: 6991855 (2006-01-01), Weihs et al.
patent: 6991856 (2006-01-01), Weihs et al.
patent: 2001/0038029 (2001-11-01), Weihs et al.
patent: 2001/0046597 (2001-11-01), Weihs et al.
patent: 2002/0182436 (2002-12-01), Weihs et al.
patent: 0381509 (1990-08-01), None
patent: 990692 (1965-04-01), None
Martin, J.I., et al., “Ordered Magnetic Nanostructures: Fabrication and Properties” Journal of Magnetism and Magnetic Materials, vol. 256, pp. 449-501 (2003).
Brankovic, S.R., et al., “Surfactant Mediated Electrochemical Deposition of Ag on Au(111)” Electrochemical and Solid-State Letters, vol. 2, pp. 443-445 (1999).
Kumar, A., et al., “Patterning Self-Assembled Monolayers: Applications in Materials Science” Langmuir, vol. 10, pp. 1498-1511 (1994).
Noguchi, K., et al., “Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding” Materials Transactions, vol. 42, No. 5, pp. 761-768 (2001).
Kim, K.S., et al., “Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys” Materials Science and Engineering, vol. A333, pp. 106-114 (2002).
Tang, J., et al., “Factors Affecting The Lamellar Spacing in Two-Phase TiAl Alloys With Fully Lamellar Microstructures” Materials Research Bulletin, vol. 36, pp. 1737-1742 (2001).
Mei, Z., et al., “Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates” Electronics Packaging, vol. 114, pp. 104-108 (Jun. 1992).
Miyazawa, Y., et al., “Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys” Materials Transactions, vol. 42, pp. 776-782 (2001).
Hu, J.N., et al., “Aging Behavior of a Sn-Bi Eutectic Solder at Temperatures Between 233 and 373 K” Materials Transactions, vol. 42, No. 5, pp. 769-775 (2001).
Liu, Y., “Lamellar Spacing and Mechanical Property of Undercooled Ti-45Al-2Cr-2Nb Alloy” Materials Letters, vol. 57, pp. 2262-2266 (2003).
Liu, C.T., et al., “Tensile Properties and Fracture Toughness of TiAl Alloys With Controlled Microstructures” Intermetallics, vol. 4, pp. 429-440 (1996).
Tang, J., et al., “Hall-Petch Relationship in Two-Phase TiAl Alloys With Fully Lamellar Microstructures” Materials Research Bulletin, vol. 37, pp. 1315-1321 (2002).
Sun, Y.Q., “An Extended Dislocation Pile-Up Model For The Yield Strength of Lamellar Microstructures” Philosophical Magazine, vol. 77, No. 4, pp. 1107-1126 (1998).
Choi, C., et al., “Effects Of Microstructural Parameters On The Fatigue Crack Growth of Fully Lamellar γ-TiAl Alloys” Materials Science and Engineering, vol. A329-A331, pp. 545-556 (2002).
Ma, E., et al., “Self-Propagating Explosive Reactions in Al/Ni Multilayer Thin Films” Appl. Phys. Letters, vol. 57, pp. 1262-1264 (Sep. 17, 1990).
Dyer, T.S., et al., “The Combustion Synthesis of Multilayer NiAl Systems” Scripta Metallurgica et Materialia, vol. 30, No. 10, pp. 1281-1286 (1994).
Clevenger, L.A., et al., “Explosive Silicidation in Nickel/Amorphous-Silicon Multilayer Thin Films” J. Appl. Phys., vol. 67, pp. 2894-2897 (Mar. 15, 1990).
Lee, S.B., et al., “A Mechanistic Model For Fatigue Life Prediction of Solder Joints For Electronic Packages” Int. J. Fatigue, vol. 19, No. 1, pp. 85-91 (1997).
Kruger, R., et al., “Hermetic Glass Sealing of AIN Packages For High Temperature Applications” Journal of European Ceramic Society, vol. 19, pp. 1067-1070 (1999).
Swiston, Jr., A.M., et al., “Joining Bulk Metallic Glass Using Reactive Multilayer Foils” Scripta Materialia, vol. 48, pp. 1575-1580 (2003).
Etienne, Besnoin, et al. “Effect of Reactant and Product Melting on Self-Propagating Reactions in Multilayer Foils” Journal of Applied Physics, American Institute of Physics, 2002, 5474-5481, 92-9, New York, NY.
Jayaraman, S., et al., “A Numerical Study of Unsteady Self-Propagating Reactions in Multilayer Foils” Proceedings of the Combustion Institute, 1998, 2459-2467, 27 Elsevier, NL.
Jayaraman, S., et al., “Numerical Predictions of Oscillatory Combustion in Reactive Multilayers” Journal of Applied Physics, 1999, 800-809, 86-2, Institute of Physics, New York, NY.
Besnoin Etienne
Knio Omar
Wang Jiaping
Weihs Timothy P.
Hendricks Keith D.
Johns Hopkins University
Lowenstein & Sandler PC
Savage Jason L.
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