Multilayer substrate including components therein

Details Multilayer substrate including components therein Multilayer substrate including components therein

2008-05-27

2008-05-27

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C174S260000, C174S262000, C438S637000

Reexamination Certificate

active

11114781

ABSTRACT:
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.

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patent: WO 03/103355 (2003-12-01), None

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