Unmolded package for a semiconductor device

Details Unmolded package for a semiconductor device Unmolded package for a semiconductor device

2008-07-01

2008-07-01

Nguyen, Dao H (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S109000, C438S127000, C257S686000, C257S777000, C257SE21503, C257SE23065

Reexamination Certificate

active

11202510

ABSTRACT:
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface of the serves as the drain connections while the solder balls serve as the source and gate connections.

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