Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-29
2008-01-29
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C369S243000, C165S104330, C713S300000
Reexamination Certificate
active
11175376
ABSTRACT:
In a disk array system, techniques advantageous in terms of economy and maintenance and capable of realizing high-density wiring of data signal wiring and power feed wiring on a backboard, and flexibly implementing specification change, processing performance improvement, etc. are provided according to a DKC mounting method different from conventional ones. In a power feed unit of the backboard, the power feed wiring comprises a bus bar of three-dimensional structure which reserves a gap distance with respect to a face of the backboard. The data signal wiring connecting connectors is provided in an area below the bus bar, thereby providing high-density wiring. The gap distance is formed to meet a design specification which makes the power supply noise influence of the power feed wiring of the bus bar on the data signal wiring satisfactory small. Power feed connectors and locator pins for logical packages are connected on the bus bar.
REFERENCES:
patent: 5675816 (1997-10-01), Hiyoshi
patent: 2005/0270927 (2005-12-01), Hayashi
patent: 2006/0039108 (2006-02-01), Chikusa et al.
patent: 2006/0149979 (2006-07-01), Sakakibara et al.
Duong Hung Van
Hitachi , Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
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