Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-04-01
2008-04-01
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23062, C257S023000, C257SE23097, C257S701000, C257S528000, C257S532000, C257S288000, C257S296000, C257S773000, C257S774000, C257SE27104, C257SE27081, C257SE27112, C257SE27048, C257S698000, C257S778000, C361S306100, C361S311000, C361S782000, C174S050510, C174S260000, C174S565000
Reexamination Certificate
active
11128813
ABSTRACT:
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing a paraelectric filler with an inorganic filler having a high dielectric constant.
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Iijima Takahiro
Rokugawa Akio
Shimizu Noriyoshi
Yamasaki Tomoo
Ladas & Parry LLP
Shinko Electric Industries Co. Ltd.
Williams Alexander Oscar
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