Positive photoresist composition

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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C430S192000, C430S193000

Reexamination Certificate

active

11637103

ABSTRACT:
A positive photoresist composition comprising an alkali-soluble resin, a 1,2-quinonediazide compound, an organic solvent, and a fluorinated organosilicon compound of formula (1) serving as a surfactant can be effectively coated to uniformity over large areas and is improved in resist pattern profile. Rf is a C5-C30perfluoroalkyl group containing at least one ether bond, Q is a polyether group consisting of an ethylene glycol and/or propylene glycol polymer chain, R is H or C1-C4alkyl, X is a divalent linking group exclusive of oxygen, Y is a divalent linking group, p is an integer of at least 3, and 0<n<3.

REFERENCES:
patent: 4504567 (1985-03-01), Yamamoto et al.
patent: 6866982 (2005-03-01), Kato et al.
patent: 57-178242 (1982-11-01), None
patent: 59-142538 (1984-08-01), None
patent: 03-022619 (1991-01-01), None
patent: 2000-181055 (2000-06-01), None

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