Resin composition and flexible printed circuit board

Details Resin composition and flexible printed circuit board Resin composition and flexible printed circuit board

Filed on

2008-04-22

Date issued

2008-04-22

Examiner

Cain, Edward J. (Department: 1714)

Patent Class

Synthetic resins or natural rubbers -- part of the class 520 ser

SubClass

Synthetic resins

SubSubClass

At least one aryl ring which is part of a fused or bridged...

Other Related Categories

C524S430000, C524S445000, C524S447000, C524S449000, C524S451000

Type

Reexamination Certificate

Status

active

Patent number

10148276

Description

ABSTRACT:
A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties;pH of aqueous dispersion: 5.5-8.0,amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below,maximum diameter a: 50 μm or below,thickness b: 1.0 μm or below, andaspect ratio (a/b): 20 or above.

REFERENCES:
patent: 5368921 (1994-11-01), Ishii et al.
patent: 0660336 (1995-06-01), None
Patent Abstracts of Japan vol. 1996, No. 06, Jun. 28, 1996 & JP 08 041247 A (Otsuka Chem Co Ltd), Feb. 13, 1996.
Patent Abstracts of Japan vol. 014, No. 363 (C-0746), Aug. 7, 1990 & JP 02 133440 A (Matsushita Electric Works Ltd), May 22, 1990.
Patent Abstracts of Japan vol. 018, No. 043 (C-1156), Jan. 24, 1994 & JP 05 270815 A (Topy Ind Ltd), Oct. 19, 1993.
JP 10-226751 A, and English Abstract thereof, dated Aug. 25, 1998.
JP 09-208822 A, and English Abstract thereof, dated Aug. 12, 1997.
JP 09-124836 A, and English Abstract thereof, dated May 13, 1997.

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