Structures and methods to enhance copper metallization

Details Structures and methods to enhance copper metallization Structures and methods to enhance copper metallization

2008-05-27

2008-05-27

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C438S637000, C438S659000, C438S687000, C257SE21649, C257S774000, C257S773000

Reexamination Certificate

active

10196081

ABSTRACT:
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a metallization layer. The insulator includes a polymer or an insulating oxide compound. And, the inhibiting layer has a compound formed from a reaction between the polymer or insulating oxide compound and a transition metal, a representative metal, or a metalloid.

REFERENCES:
patent: 2842438 (1958-07-01), Saarivirta et al.
patent: 3515663 (1970-06-01), Bodway
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4213818 (1980-07-01), Lemons et al.
patent: 4386116 (1983-05-01), Nair et al.
patent: 4394223 (1983-07-01), Hall
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4565157 (1986-01-01), Brors et al.
patent: 4574095 (1986-03-01), Baum et al.
patent: 4762728 (1988-08-01), Keyser et al.
patent: 4788082 (1988-11-01), Schmitt
patent: 4824544 (1989-04-01), Mikalesen et al.
patent: 4847111 (1989-07-01), Chow et al.
patent: 4931410 (1990-06-01), Tokunaga et al.
patent: 4933743 (1990-06-01), Thomas et al.
patent: 4948459 (1990-08-01), Van Laarhoven et al.
patent: 4962058 (1990-10-01), Cronin et al.
patent: 4990229 (1991-02-01), Campbell et al.
patent: 4996584 (1991-02-01), Young et al.
patent: 5019531 (1991-05-01), Awaya et al.
patent: 5034799 (1991-07-01), Tomita et al.
patent: 5071518 (1991-12-01), Pan
patent: 5084412 (1992-01-01), Nakasaki
patent: 5100499 (1992-03-01), Douglas
patent: 5130274 (1992-07-01), Harper et al.
patent: 5149615 (1992-09-01), Chakravorty et al.
patent: 5158986 (1992-10-01), Cha et al.
patent: 5171712 (1992-12-01), Wang et al.
patent: 5173442 (1992-12-01), Carey
patent: 5231056 (1993-07-01), Sandhu
patent: 5240878 (1993-08-01), Fitzsimmons et al.
patent: 5243222 (1993-09-01), Harper et al.
patent: 5256205 (1993-10-01), Schmitt, III et al.
patent: 5334356 (1994-08-01), Baldwin et al.
patent: 5348811 (1994-09-01), Nagao et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5371042 (1994-12-01), Ong
patent: 5374849 (1994-12-01), Tada
patent: 5384284 (1995-01-01), Doan et al.
patent: 5401680 (1995-03-01), Abt et al.
patent: 5413687 (1995-05-01), Barton et al.
patent: 5426330 (1995-06-01), Joshi et al.
patent: 5442237 (1995-08-01), Hughes et al.
patent: 5447887 (1995-09-01), Filipiak et al.
patent: 5451804 (1995-09-01), Lur et al.
patent: 5461243 (1995-10-01), Ek et al.
patent: 5470789 (1995-11-01), Misawa
patent: 5470801 (1995-11-01), Kapoor et al.
patent: 5476817 (1995-12-01), Numata
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5506449 (1996-04-01), Nakano et al.
patent: 5529956 (1996-06-01), Morishita
patent: 5538922 (1996-07-01), Cooper et al.
patent: 5539060 (1996-07-01), Tsunogae et al.
patent: 5595937 (1997-01-01), Mikagi
patent: 5609721 (1997-03-01), Tsukune et al.
patent: 5625232 (1997-04-01), Numata et al.
patent: 5625233 (1997-04-01), Cabral, Jr. et al.
patent: 5633200 (1997-05-01), Hu
patent: 5635253 (1997-06-01), Canaperi et al.
patent: 5635423 (1997-06-01), Huang et al.
patent: 5654245 (1997-08-01), Allen
patent: 5662788 (1997-09-01), Sandhu et al.
patent: 5670420 (1997-09-01), Choi
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5675187 (1997-10-01), Numata et al.
patent: 5679608 (1997-10-01), Cheung et al.
patent: 5681441 (1997-10-01), Svendsen et al.
patent: 5693563 (1997-12-01), Teong
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5719089 (1998-02-01), Cherng et al.
patent: 5719410 (1998-02-01), Suehiro et al.
patent: 5719447 (1998-02-01), Gardner
patent: 5739579 (1998-04-01), Chiang et al.
patent: 5763953 (1998-06-01), Iljima et al.
patent: 5780358 (1998-07-01), Zhou
patent: 5785570 (1998-07-01), Bruni
patent: 5789264 (1998-08-01), Chung
patent: 5792522 (1998-08-01), Jin et al.
patent: 5801098 (1998-09-01), Fiordalice et al.
patent: 5814557 (1998-09-01), Venkatraman et al.
patent: 5821168 (1998-10-01), Jain
patent: 5824599 (1998-10-01), Schacham-Diamond et al.
patent: 5840625 (1998-11-01), Feldner
patent: 5858877 (1999-01-01), Dennison et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5891804 (1999-04-01), Havemann et al.
patent: 5893752 (1999-04-01), Zhang et al.
patent: 5895740 (1999-04-01), Chien et al.
patent: 5897370 (1999-04-01), Joshi et al.
patent: 5899740 (1999-05-01), Kwon
patent: 5907772 (1999-05-01), Iwasaki
patent: 5911113 (1999-06-01), Yao et al.
patent: 5913147 (1999-06-01), Dubin et al.
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5932928 (1999-08-01), Clampitt
patent: 5933758 (1999-08-01), Jain
patent: 5937320 (1999-08-01), Andricacos et al.
patent: 5939771 (1999-08-01), Usami
patent: 5940733 (1999-08-01), Beinglass et al.
patent: 5948467 (1999-09-01), Nguyen et al.
patent: 5962923 (1999-10-01), Xu et al.
patent: 5968327 (1999-10-01), Kobayashi et al.
patent: 5968333 (1999-10-01), Nogami et al.
patent: 5969398 (1999-10-01), Murakami
patent: 5969422 (1999-10-01), Ting et al.
patent: 5972179 (1999-10-01), Chittipeddi et al.
patent: 5972804 (1999-10-01), Tobin et al.
patent: 5976710 (1999-11-01), Sachdev et al.
patent: 5981350 (1999-11-01), Geusic et al.
patent: 5985759 (1999-11-01), Kim et al.
patent: 5985762 (1999-11-01), Geffken et al.
patent: 5989623 (1999-11-01), Chen et al.
patent: 5994777 (1999-11-01), Farrar
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6001736 (1999-12-01), Kondo et al.
patent: 6002175 (1999-12-01), Maekawa
patent: 6004884 (1999-12-01), Abraham
patent: 6008117 (1999-12-01), Hong et al.
patent: 6015465 (2000-01-01), Kholodenko et al.
patent: 6017820 (2000-01-01), Ting et al.
patent: 6022802 (2000-02-01), Jang
patent: 6028362 (2000-02-01), Omura
patent: 6030877 (2000-02-01), Lee et al.
patent: 6030895 (2000-02-01), Joshi et al.
patent: 6037248 (2000-03-01), Ahn
patent: 6037664 (2000-03-01), Zhao et al.
patent: 6054172 (2000-04-01), Robinson et al.
patent: 6054398 (2000-04-01), Pramanick
patent: 6065424 (2000-05-01), Shacham-Diamand et al.
patent: 6069068 (2000-05-01), Rathore et al.
patent: 6071810 (2000-06-01), Wada et al.
patent: 6077792 (2000-06-01), Farrar
patent: 6100193 (2000-08-01), Suehiro et al.
patent: 6103320 (2000-08-01), Matsumoto et al.
patent: 6107186 (2000-08-01), Erb
patent: 6117781 (2000-09-01), Lukanc et al.
patent: 6117782 (2000-09-01), Lukanc
patent: 6120641 (2000-09-01), Stevens et al.
patent: 6121149 (2000-09-01), Lukanc et al.
patent: 6121150 (2000-09-01), Avanzino et al.
patent: 6126989 (2000-10-01), Robinson et al.
patent: 6130161 (2000-10-01), Ashley et al.
patent: 6136095 (2000-10-01), Xu et al.
patent: 6139699 (2000-10-01), Chiang et al.
patent: 6140228 (2000-10-01), Shan et al.
patent: 6140234 (2000-10-01), Uzoh et al.
patent: 6143604 (2000-11-01), Chiang et al.
patent: 6143641 (2000-11-01), Kitch
patent: 6143646 (2000-11-01), Wetzel
patent: 6143650 (2000-11-01), Pramanick et al.
patent: 6143655 (2000-11-01), Forbes et al.
patent: 6143671 (2000-11-01), Sugai
patent: 6150214 (2000-11-01), Kaeriyama
patent: 6150261 (2000-11-01), Hsu et al.
patent: 6153507 (2000-11-01), Mikagi
patent: 6159769 (2000-12-01), Farnworth et al.
patent: 6162583 (2000-12-01), Yang et al.
patent: 6168704 (2001-01-01), Brown et al.
patent: 6169024 (2001-01-01), Hussein
patent: 6171661 (2001-01-01), Zheng et al.
patent: 6174800 (2001-01-01), Jang
patent: 6174804 (2001-01-01), Hsu
patent: 6177350 (2001-01-01), Sundarrajan et al.
patent: 6181012 (2001-01-01), Edelstein et al.
patent: 6183564 (2001-02-01), Reynolds et al.
patent: 6184121 (2001-02-01), Buchwalter et al.
patent: 6187656 (2001-02-01), Lu et al.
patent: 6190732 (2001-02-01), Omstead et al.
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6197181 (2001-03-01), Chen
patent: 6197688 (2001-03-01), Simpson
patent: 6204096 (2001-03-01), Lai et al.
patent: 6207222 (2001-03-01), Chen et al.
patent: 6207553 (2001-03-01), Buynoski et al.
patent: 6207558 (2001-03-01), Singhvi et al.
patent: 6208016 (2001-03-01), Farrar
patent: 6211049 (2001-04-01), Farrar
patent: 6211071 (2001-04-01), Lukanc et al.
patent: 6211073 (2001-04-0

Affiliated with

Also associated with

Rating

Structures and methods to enhance copper metallization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structures and methods to enhance copper metallization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structures and methods to enhance copper metallization will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3917394