Method for production of a semiconductor device with...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C438S057000, C438S083000, C257SE31003

Reexamination Certificate

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10555072

ABSTRACT:
This invention relates to a process for making a semiconductor device comprising the following steps:a doped region with a first type of conductivity is made on a first principal face of a semiconductor substrate and at least one window is made,a first metallisation area is deposited on the doped region,a dielectric layer is deposited on at least the window and the first metallisation area,at least a first opening is etched in the dielectric layer at the window to accommodate a doped region with a second type of conductivity while arranging an undoped portion of the semiconductor substrate laterally between the doped regions,the substrate is doped to create the doped region with the second type of conductivity,a second metallisation area is deposited.Application particularly for solar cells in thin layer.

REFERENCES:
patent: 4927770 (1990-05-01), Swanson
patent: 6396046 (2002-05-01), Possin et al.
patent: 6423568 (2002-07-01), Verlinden et al.
Swanson et al., “Point-Contact Silicon Solar Cells”, Transactions on Electron Devices, vol. ED-31, No. 5, May 1984, 1984, pp. 661-664.
C. L. Tilford et al., “Development of a 10 kw Reflective Dish PV System”, IEEE, 1993, pp. 1222-1227.
P. Verlinden et al., “Multilevel Metallization for Large Area Point-Contact Solar Cells”, Proceedings of the International Photovoltaic Energy Conference, May 9-13, 1988, pp. 1466-1471.
French Preliminary Search Report for Application No. 0350136000, dated Jan. 26, 2004.

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