Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-01-08
2008-01-08
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S828000, C029S847000, C029S849000, C029S851000, C029S852000, C029S853000, C174S036000, C174S250000, C361S707000, C438S618000
Reexamination Certificate
active
10755905
ABSTRACT:
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by masking and etching. Additional layers of conductive materials may be used to provide a barrier layer and a noble metal cap for the conductive elements. The methods of the present invention may be used to fabricate an interposer for use in packaging semiconductor devices or a test substrate. Substrate precursor structures are also disclosed.
REFERENCES:
patent: 4605471 (1986-08-01), Mitchell
patent: 4692349 (1987-09-01), Georgiou et al.
patent: 4808273 (1989-02-01), Hua et al.
patent: 4954313 (1990-09-01), Lynch
patent: 4978639 (1990-12-01), Hua et al.
patent: 4987639 (1991-01-01), Baiuley et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5245751 (1993-09-01), Locke et al.
patent: 5262718 (1993-11-01), Svendsen et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5682062 (1997-10-01), Gaul
patent: 5897368 (1999-04-01), Cole, Jr. et al.
patent: 6032527 (2000-03-01), Genova et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6169024 (2001-01-01), Hussein
patent: 6197664 (2001-03-01), Lee et al.
patent: 6228684 (2001-05-01), Maruyama
patent: 6228687 (2001-05-01), Akram et al.
patent: 6228754 (2001-05-01), Iacoponi et al.
patent: 6230400 (2001-05-01), Tzanavaras et al.
patent: 6235624 (2001-05-01), Sasaki et al.
patent: 6242935 (2001-06-01), Akram
patent: 6252300 (2001-06-01), Hsuan et al.
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6277669 (2001-08-01), Kung et al.
patent: 6291332 (2001-09-01), Yu et al.
patent: 6384481 (2002-05-01), Hussein et al.
patent: 6406939 (2002-06-01), Lin
patent: 6418616 (2002-07-01), Bhatt et al.
patent: 6448644 (2002-09-01), Lin
patent: 6468889 (2002-10-01), Iacoponi et al.
patent: 6479382 (2002-11-01), Naem
patent: 6562709 (2003-05-01), Lin
patent: 6565729 (2003-05-01), Chen et al.
patent: 6565730 (2003-05-01), Chakravorty et al.
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6711812 (2004-03-01), Lu et al.
patent: 6963483 (2005-11-01), Chakravorty et al.
patent: 7007378 (2006-03-01), Gaudiello et al.
patent: 2001/0024129 (2001-09-01), Akram et al.
patent: 2002/0115290 (2002-08-01), Halahan et al.
patent: 2003/0057097 (2003-03-01), Tsai et al.
patent: 2003/0082356 (2003-05-01), Suemasu et al.
patent: 0 907 206 (1999-04-01), None
patent: 11-251316 (1999-09-01), None
U.S. Appl. No. 10/379,890, filed Mar. 5, 2003, for “Conductive Through Wafer Vias.”
International Search Report, dated Apr. 12, 2005, 7 pages.
Written Opinion of the International Searching Authority, dated Apr. 12, 2005, 9 pages.
Farnworth Warren M.
Hiatt William M.
McDonald Steven M.
Sinha Nishant
Micro)n Technology, Inc.
Phan Tim
Tugbang A. Dexter
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