Molded aluminum nitride packages

Details Molded aluminum nitride packages Molded aluminum nitride packages

1996-07-01

1998-08-11

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257705, 257704, 257703, 257698, H05K 506

Patent

active

057929840

ABSTRACT:
An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form desired circuitry patterns. The lead frame is inserted through the open holes in the aluminum nitride housing and chemically and mechanically bonded thereto using active braze The active braze attaches the lead frame not only to the open holes in the package, but also to the wall of the housing over a larger area. Active braze forms a strong bond between the aluminum nitride and the lead frame, and also forms an excellent and highly reliable thermal junction therebetween. Several different package constructions are illustrated. In one design the aluminum nitride takes on a bathtub configuration onto which a flat cover may be attached. In an alternative embodiment, a metal seal ring is brazed to a relatively flat aluminum nitride base, which allows prior art roller welding, soldering or brazing of a lid to the seal ring after all devices are installed into the aluminum nitride package. The resultant packages are hermetic, reliable, corrosion resistant, and capable of withstanding extremely high temperatures with no loss of hermeticity.

REFERENCES:
patent: 4167647 (1979-09-01), Salera
patent: 4266090 (1981-05-01), Scherer
patent: 4412093 (1983-10-01), Wildeboer
patent: 4506108 (1985-03-01), Kersch et al.
patent: 5109268 (1992-04-01), Butera
patent: 5528079 (1996-06-01), McIver
patent: 5574314 (1996-11-01), Okada et al.

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