Semiconductor device with bonding pad support structure

Details Semiconductor device with bonding pad support structure Semiconductor device with bonding pad support structure

2008-07-08

2008-07-08

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23011, C257SE23020, C257SE23132, C257SE23145, C257S700000, C257S701000, C257S459000, C257S774000, C257S680000, C257S750000, C257S762000

Reexamination Certificate

active

10761204

ABSTRACT:
A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and that has a copper area ratio that is greater than layers in which circuit interconnects are formed; and a lower copper layer that is electrically insulated from the upper copper layer and that is formed closer to the semiconductor substrate than the upper copper layer.

REFERENCES:
patent: 5986343 (1999-11-01), Chittipeddi et al.
patent: 6143396 (2000-11-01), Saran et al.
patent: 6232662 (2001-05-01), Saran
patent: 6297563 (2001-10-01), Yamaha
patent: 6410435 (2002-06-01), Ryan
patent: 6461956 (2002-10-01), Hsuan et al.
patent: 6677338 (2004-01-01), Madras et al.
patent: 6713381 (2004-03-01), Barr et al.
patent: 6731007 (2004-05-01), Saito et al.
patent: 6737345 (2004-05-01), Lin et al.
patent: 6746951 (2004-06-01), Liu et al.
patent: 6747355 (2004-06-01), Abiru et al.
patent: 6780757 (2004-08-01), Suzuki et al.
patent: 6803302 (2004-10-01), Pozder et al.
patent: 6838769 (2005-01-01), Chittipeddi et al.
patent: 6900541 (2005-05-01), Wang et al.
patent: 7122902 (2006-10-01), Hatano et al.
patent: 7208837 (2007-04-01), Wang et al.
patent: 2001/0010408 (2001-08-01), Ker et al.
patent: 2001/0043917 (2001-11-01), Merril et al.
patent: 2001/0051426 (2001-12-01), Pozder et al.
patent: 2002/0005582 (2002-01-01), Nogami et al.
patent: 2002/0047218 (2002-04-01), Liu et al.
patent: 2002/0079576 (2002-06-01), Seshan
patent: 2002/0163083 (2002-11-01), Hatano et al.
patent: 2002/0192919 (2002-12-01), Bothra
patent: 2003/0020163 (2003-01-01), Hung et al.
patent: 2003/0047794 (2003-03-01), Watanabe
patent: 2004/0070042 (2004-04-01), Lee et al.
patent: 2005/0258484 (2005-11-01), Itou
patent: 03-1538 (1991-01-01), None
patent: 11-54544 (1999-02-01), None
patent: 2000-114309 (2000-04-01), None
patent: 2001-15516 (2001-01-01), None
patent: 2001-267323 (2001-09-01), None
patent: 2001-358169 (2001-12-01), None

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