Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2008-01-29
2008-01-29
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S680000
Reexamination Certificate
active
11114118
ABSTRACT:
A semiconductor substrate has an integrated circuit, an interconnect electrically connected to the inside of the semiconductor substrate, and an electrode formed on the interconnect. A plurality of resin layers are separately formed on the semiconductor substrate so that part of the semiconductor substrate is exposed. A redistribution interconnect is electrically connected to the electrode. An external terminal is formed on the redistribution interconnect and supported by the resin layers.
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U.S. Appl. No. 10/637,614, filed Aug. 11, 2003, Yamaguchi.
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