Heat sink for surface-mounted semiconductor devices and...

Details Heat sink for surface-mounted semiconductor devices and... Heat sink for surface-mounted semiconductor devices and...

2008-04-08

2008-04-08

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S717000, C361S719000, C165S080200, C165S080300, C165S104330, C174S016300, C174S252000

Reexamination Certificate

active

11375565

ABSTRACT:
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

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