Substrate structure, substrate manufacturing method and...

Details Substrate structure, substrate manufacturing method and... Substrate structure, substrate manufacturing method and...

2008-01-22

2008-01-22

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S331000

Reexamination Certificate

active

11635224

ABSTRACT:
According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.

REFERENCES:
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patent: 5324569 (1994-06-01), Nagesh
patent: 5460538 (1995-10-01), Ikeya
patent: 6162066 (2000-12-01), Glick et al.
patent: 6749443 (2004-06-01), Sano et al.
patent: 6763581 (2004-07-01), Hirai
patent: 2005/0106904 (2005-05-01), Yoshida
patent: 6-268366 (1994-09-01), None

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