Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-16
2007-10-16
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S777000, C257S778000, C257S777000, C174S260000, C174S261000, C174S257000
Reexamination Certificate
active
10368240
ABSTRACT:
An electronic device comprises an IC provided with an array of pads a preselected number of which define inspection pads of the IC. A substrate has inspection patterns and is mounted on the IC so that each inspection pad is brought into contact with a corresponding inspection pattern to thereby enable electrical inspection of a mounting condition of the IC on the substrate. A pair of inspection lands is provided on the substrate and connected to some of the inspection patterns. The inspection pads and the inspection patterns are connected by wiring provided on the IC or on the substrate so that the inspection lands are electrically connected to each other when the IC is mounted on the substrate. A centerline of at least one of the inspection patterns is offset in position from a centerline of the corresponding inspection pad in width directions of the inspection pattern and the inspection pad.
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Adams & Wilks
Bui Hung S.
Reichard Dean A.
Seiko Instruments Inc.
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