Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-30
2007-10-30
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S714000, C361S719000, C361S733000, C257S704000, C257S713000, C257S714000
Reexamination Certificate
active
11345957
ABSTRACT:
A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.
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Heydari Ali
Yang Ji L.
Hogan & Hartson LLP
Kubida William J.
Martensen Michael C.
Sun Microsystems Inc.
Thomas Bradley H
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