Component mounting method

Details Component mounting method Component mounting method

2007-10-16

2007-10-16

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000

Reexamination Certificate

active

11426735

ABSTRACT:
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

REFERENCES:
patent: 4521828 (1985-06-01), Fanning
patent: 4617708 (1986-10-01), Fanning
patent: 4884237 (1989-11-01), Mueller et al.
patent: 6462408 (2002-10-01), Wehrly, Jr.
patent: 6572387 (2003-06-01), Burns et al.
patent: 6608763 (2003-08-01), Burns et al.
patent: 6806120 (2004-10-01), Wehrly, Jr.
patent: 6919626 (2005-07-01), Burns
patent: 7066741 (2006-06-01), Burns et al.
patent: 7098073 (2006-08-01), Mangrum
patent: 7196427 (2007-03-01), Mangrum
patent: 3132353 (2000-11-01), None

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