Methods for designing bond pad rerouting elements for use in...

Details Methods for designing bond pad rerouting elements for use in... Methods for designing bond pad rerouting elements for use in...

2007-10-16

2007-10-16

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21499

Reexamination Certificate

active

11352685

ABSTRACT:
A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially planar member and at a location that corresponds to the location of a bond pad of a semiconductor device with which the rerouting element is to be used. The at least one conductive element, which communicates with the at least one contact location, reroutes the bond pad location of the semiconductor device to a corresponding rerouted bond pad location adjacent to a second one peripheral edge of the rerouted substantially planar member which is opposite the first periphered edge. In addition, assemblies including rerouting elements and methods for designing and using rerouting elements are disclosed.

REFERENCES:
patent: 4341594 (1982-07-01), Carlson et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4803147 (1989-02-01), Mueller et al.
patent: 4948754 (1990-08-01), Kondo et al.
patent: 5049980 (1991-09-01), Saito et al.
patent: 5111279 (1992-05-01), Pasch
patent: 5168346 (1992-12-01), Pasch
patent: 5207887 (1993-05-01), Crumly et al.
patent: 5275973 (1994-01-01), Gelatos
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5347162 (1994-09-01), Pasch
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5410805 (1995-05-01), Pasch et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5489804 (1996-02-01), Pasch
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5506756 (1996-04-01), Haley
patent: 5527741 (1996-06-01), Cole et al.
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5565033 (1996-10-01), Gaynes et al.
patent: 5569963 (1996-10-01), Rostoker et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5672912 (1997-09-01), Aoki et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5683942 (1997-11-01), Kata et al.
patent: 5770889 (1998-06-01), Rostoker et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5821624 (1998-10-01), Pasch
patent: 5834799 (1998-11-01), Rostoker et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5843798 (1998-12-01), Matsuda
patent: 5844304 (1998-12-01), Kata et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5886409 (1999-03-01), Ishino et al.
patent: 5886415 (1999-03-01), Akagawa
patent: 5907787 (1999-05-01), Sato
patent: 5925931 (1999-07-01), Yamamoto
patent: 5946555 (1999-08-01), Crumly et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 5977641 (1999-11-01), Takahashi et al.
patent: 6030889 (2000-02-01), Aulicino et al.
patent: 6043109 (2000-03-01), Yang et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6069071 (2000-05-01), Haunuma et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6117539 (2000-09-01), Crotzer et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6172569 (2001-01-01), McCall et al.
patent: 6179200 (2001-01-01), Kung et al.
patent: 6181569 (2001-01-01), Chakravorty
patent: 6211572 (2001-04-01), Fjelstad et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6228687 (2001-05-01), Akram et al.
patent: 6233184 (2001-05-01), Barth et al.
patent: 6255737 (2001-07-01), Hashimoto
patent: 6284563 (2001-09-01), Fjelstad
patent: 6285203 (2001-09-01), Akram et al.
patent: 6294407 (2001-09-01), Jacobs
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6319810 (2001-11-01), Ochai et al.
patent: 6334249 (2002-01-01), Hsu
patent: 6343171 (2002-01-01), Yoshimura et al.
patent: 6348731 (2002-02-01), Ashley et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6392306 (2002-05-01), Khandros et al.
patent: 6434017 (2002-08-01), Iwabuchi
patent: 6458231 (2002-10-01), Wapner et al.
patent: 6475896 (2002-11-01), Hashimoto
patent: 6492200 (2002-12-01), Park et al.
patent: 6515370 (2003-02-01), Hashimoto
patent: 6534853 (2003-03-01), Liu et al.
patent: 6573609 (2003-06-01), Fjelstad
patent: 6590292 (2003-07-01), Barber et al.
patent: 7094631 (2006-08-01), Corisis et al.
patent: 2001/0006759 (2001-07-01), Shipley, Jr. et al.
patent: 2003/0038378 (2003-02-01), Jacobs
Vardaman, Jan, “What Does a CSP Cost?,” Advanced Packaging's Guide to Emerging Technologies, Jul./Aug. 1997 (1 page).

Affiliated with

Also associated with

Rating

Methods for designing bond pad rerouting elements for use in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for designing bond pad rerouting elements for use in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for designing bond pad rerouting elements for use in... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3901310