Polyphenylene ether oligomer compound, derivatives thereof...

Details Polyphenylene ether oligomer compound, derivatives thereof... Polyphenylene ether oligomer compound, derivatives thereof...

2007-10-02

2007-10-02

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C174S256000, C428S297400, C428S413000, C428S418000, C523S466000, C525S482000, C525S484000, C525S526000

Reexamination Certificate

active

10980246

ABSTRACT:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

REFERENCES:
patent: 7022776 (2006-04-01), Bastiaens et al.
patent: 60-229923 (1985-11-01), None
patent: 62-41223 (1987-02-01), None
patent: 62041223 (1987-02-01), None
patent: 11-029621 (1999-02-01), None
patent: 11-29621 (1999-02-01), None
Abstract, JP 62041223, Saito, Feb. 23, 1987.
Abstract, Machine Translation, JP 10120611, Katagiri et al., May 12, 1998.
Abstract, JP 11029621, Katagiri et al., Feb. 2, 1999.

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