Image sensor packaging method and structure thereof

Details Image sensor packaging method and structure thereof Image sensor packaging method and structure thereof

2007-08-07

2007-08-07

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S026000

Reexamination Certificate

active

10948297

ABSTRACT:
A method for packaging an image sensor includes the steps of providing a substrate, forming a first adhesive on one surface of the substrate, attaching a transparent material on the first adhesive, cutting or carving the surface of the transparent material to a depth penetrating the transparent material while not penetrating the first adhesive, cleaning the cut or carved surface of the transparent material, depositing a frame glue on the transparent material, and combining the transparent material with a microchip that includes a plurality of micro-lenses. The micro-lens is packaged within the transparent material. The microchip is then ground to perform a lithography process. Next, the substrate and part of the first adhesive are detached after the lithography process. After performing a cutting or carving procedure, the packaging process of the image sensors is completed.

REFERENCES:
patent: 6285064 (2001-09-01), Foster
patent: 6995462 (2006-02-01), Bolken et al.
patent: 2006/0093811 (2006-05-01), Ookawa

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