Microelectromechanical device packages with integral heaters

Details Microelectromechanical device packages with integral heaters Microelectromechanical device packages with integral heaters

2007-10-16

2007-10-16

Le, Thao X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C257SE23081

Reexamination Certificate

active

11043507

ABSTRACT:
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.

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