Telecommunications jack assembly

Details Telecommunications jack assembly Telecommunications jack assembly

2007-12-11

2007-12-11

Hammond, Briggitte R. (Department: 2833)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

11245986

ABSTRACT:
An electrical connector including a circuit board, a contact spring insert, and an insulation displacement terminal insert wherein the contact spring insert is positioned between the insulation displacement terminal insert and the circuit board. The insert assembly can be mounted to a jack housing to form a telecommunications jack for receiving telecommunications plugs.

REFERENCES:
patent: 4274691 (1981-06-01), Abernethy et al.
patent: 4406509 (1983-09-01), Jagen
patent: 4556264 (1985-12-01), Tanaka
patent: 4698025 (1987-10-01), Silbernagel et al.
patent: 4971571 (1990-11-01), Puerner
patent: 5030123 (1991-07-01), Silver
patent: 5041018 (1991-08-01), Arnett
patent: 5044981 (1991-09-01), Suffi et al.
patent: 5071371 (1991-12-01), Harwath et al.
patent: 5156554 (1992-10-01), Rudoy et al.
patent: 5186647 (1993-02-01), Denkmann et al.
patent: 5238426 (1993-08-01), Arnett
patent: 5299956 (1994-04-01), Brownell et al.
patent: 5302140 (1994-04-01), Arnett
patent: 5310363 (1994-05-01), Brownell et al.
patent: 5362257 (1994-11-01), Neal et al.
patent: 5399107 (1995-03-01), Gentry et al.
patent: 5403200 (1995-04-01), Chen
patent: 5474474 (1995-12-01), Siemon et al.
patent: 5478261 (1995-12-01), Bogese, II
patent: 5503572 (1996-04-01), White et al.
patent: 5580257 (1996-12-01), Harwath
patent: 5624274 (1997-04-01), Lin
patent: 5639261 (1997-06-01), Rutkowski et al.
patent: 5639266 (1997-06-01), Patel
patent: 5647043 (1997-07-01), Anderson et al.
patent: 5659650 (1997-08-01), Arnett
patent: 5674093 (1997-10-01), Vaden
patent: 5700167 (1997-12-01), Pharney et al.
patent: 5713764 (1998-02-01), Brunker et al.
patent: 5716237 (1998-02-01), Conorich et al.
patent: 5735714 (1998-04-01), Orlando et al.
patent: 5759070 (1998-06-01), Belopolsky
patent: 5779503 (1998-07-01), Tremblay et al.
patent: 5785546 (1998-07-01), Hamai et al.
patent: 5791935 (1998-08-01), Yamanashi
patent: 5791943 (1998-08-01), Lo et al.
patent: 5795186 (1998-08-01), Tulley et al.
patent: 5885111 (1999-03-01), Yu
patent: 5911602 (1999-06-01), Vaden
patent: 5924896 (1999-07-01), Arnett et al.
patent: 5938479 (1999-08-01), Paulson et al.
patent: 5941734 (1999-08-01), Ikeda et al.
patent: 5947761 (1999-09-01), Pepe
patent: 5947772 (1999-09-01), Arnett et al.
patent: 6066005 (2000-05-01), Belopolsky
patent: 6083052 (2000-07-01), Adams et al.
patent: 6086428 (2000-07-01), Pharney et al.
patent: 6089909 (2000-07-01), Tokuwa
patent: 6089923 (2000-07-01), Phommachanh
patent: 6102722 (2000-08-01), Arnett
patent: 6116964 (2000-09-01), Goodrich et al.
patent: 6165023 (2000-12-01), Troutman et al.
patent: 6186834 (2001-02-01), Arnett et al.
patent: 6196880 (2001-03-01), Goodrich et al.
patent: 6234836 (2001-05-01), Schmidt et al.
patent: 6270358 (2001-08-01), Nozick
patent: 6305950 (2001-10-01), Doorhy
patent: 6334792 (2002-01-01), Schmidt et al.
patent: 6350158 (2002-02-01), Arnett et al.
patent: 6371793 (2002-04-01), Doorhy et al.
patent: 6428362 (2002-08-01), Phommachanh
patent: 6554653 (2003-04-01), Henneberger
patent: 6814624 (2004-11-01), Clark et al.
patent: 6974352 (2005-12-01), Clark et al.
patent: 0 777 304 (1997-06-01), None
patent: 2314466 (1997-12-01), None
patent: WO 97/44862 (1997-11-01), None
patent: WO 00/42682 (2000-07-01), None
The Siemon Company Catalog pages—front cover page through p. 1.39, and back cover page, dated 1999.
Panduit Corp., Tinley Park, Illinois, “Panduit® Communication Products,” cover page pp. 40-49, and back page (1996).

Affiliated with

Also associated with

Rating

Telecommunications jack assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Telecommunications jack assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Telecommunications jack assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3898388