Molding die for sealing semiconductor device with reduced resin

Details Molding die for sealing semiconductor device with reduced resin Molding die for sealing semiconductor device with reduced resin

1995-09-19

1997-06-03

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425544, 425588, 425DIG228, 26427217, B29C 4502, B29C 4526

Patent

active

056352204

ABSTRACT:
A molding die for sealing a semiconductor element with a resin includes an upper and a lower mold half. A leadframe having a resin passage aperture is sandwiched between the lower mold half and the upper mold half. The lower mold half has a lower runner space, a lower cavity, and a lower gate provided between the lower runner space and the lower cavity. The upper mold half has an upper resin well, an upper cavity, and an upper gate provided between the resin well and the upper cavity. The length of the upper resin well in the direction of the flow of resin is equal to or greater than the distance from the lower gate to the front edge of a lower runner rising slope, to thereby obtain a final product which is free from resin burrs formed in the upper resin well.

REFERENCES:
patent: 5197183 (1993-03-01), Chia et al.
patent: 5204122 (1993-04-01), Konishi

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