Alignment system and method and device manufactured thereby

Details Alignment system and method and device manufactured thereby Alignment system and method and device manufactured thereby

2007-08-21

2007-08-21

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

Identifying, composing, or selecting

C355S053000, C355S077000

Reexamination Certificate

active

10845516

ABSTRACT:
An arrangement for and a method of automatically selecting substrate alignment marks on a substrate in a lithographic apparatus or overlay metrology targets in an overlay metrology apparatus. The apparatus has a processor and a memory connected to the processor. The memory stores locations of one or more sets of substrate alignment marks or overlay metrology targets available for selection and selection rules to select suitable substrate alignment marks or overlay metrology targets from this at least one set. The selection rules are based on experimental or theoretical knowledge about which substrate alignment mark or overlay metrology targets locations are optimal in dependence on one or more selection criteria.

REFERENCES:
patent: 4778275 (1988-10-01), van den Brink et al.
patent: 6383888 (2002-05-01), Stirton
patent: 6963389 (2005-11-01), Fukada
patent: 98/39689 (1998-09-01), None
Christopher J. Gould, et al., “Advanced process control applied to metal layer overlay process”, Data Analysis and Modeling for Process Control, Proc. of SPIE, vol. 5378, pp. 28-37 (Jan. 2004).

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