Thermosetting polycarbodiimide copolymer

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

Reexamination Certificate

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Details

C264S176100, C264S219000, C428S411100

Reexamination Certificate

active

11133343

ABSTRACT:
A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.

REFERENCES:
patent: 2002/0055606 (2002-05-01), Misumi et al.
patent: 1 130 594 (1962-05-01), None
patent: 851936 (1960-10-01), None
patent: 407292229 (1995-11-01), None
European Search Report, for Application No. 05 01 0836.4-2115 PCT/, dated Sep. 2, 2005.

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