Component with ultra-high frequency connections in a substrate

Details Component with ultra-high frequency connections in a substrate Component with ultra-high frequency connections in a substrate

2007-10-09

2007-10-09

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

10541912

ABSTRACT:
The present invention relates to contacting technology for signal connections in the substrate of an extremely high frequency module, in particular a microwave or millimeter wave module. The extremely high frequency module contains a) a multilayer substrate having at least two dielectric layers and metallization layers and inter-layer connections, and b) chips positioned on the top of the multilayer substrate. The chips are electrically connected to each other and to the structures in the metallization layers by means of HF connections. The HF connection is realized by means of at least two conductor lines, which exhibit fanning. The present invention allows for simple contacting of chips having small intervals between the external contacts on the multilayer substrate.

REFERENCES:
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patent: 6127038 (2000-10-01), McCullough et al.
patent: 6215377 (2001-04-01), Douriet
patent: 6384344 (2002-05-01), Asai et al.
patent: 2002/0166689 (2002-11-01), Maetani
patent: 2004/0000425 (2004-01-01), White et al.
patent: 1 202 377 (2002-05-01), None
patent: 11 017490 (1999-01-01), None
Edward Pillai, “40Gbit/s “Fish Ladder” Signal Path and Connectorized Signal Path in Ceramic and Organic Packages for OC76 Applications” 2002 IEEE, pp. 239-242.

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