Semiconductor device with external terminal joined to...

Details Semiconductor device with external terminal joined to... Semiconductor device with external terminal joined to...

2007-02-27

2007-02-27

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000

Reexamination Certificate

active

10803178

ABSTRACT:
A semiconductor device includes a semiconductor chip provided with an integrated circuit and a pad that is electrically connected to the integrated circuit. A wiring layer has a concave portion and is electrically connected to the pad. An external terminal is joined to the concave portion of the wiring layer. A resin layer is provided with a through hole and is disposed on the wiring layer. The through hole and the concave portion reside at the same position.

REFERENCES:
patent: 5677566 (1997-10-01), King et al.
patent: 6166444 (2000-12-01), Hsuan et al.
patent: 6323542 (2001-11-01), Hashimoto
patent: 6455408 (2002-09-01), Hwang et al.
patent: 6518162 (2003-02-01), Ono et al.
patent: 6756688 (2004-06-01), Narizuka et al.
patent: 6767817 (2004-07-01), Farnworth et al.
patent: 2002/0008320 (2002-01-01), Kuwabara et al.
patent: 2004/0245621 (2004-12-01), Hanaoka et al.
patent: 11-297873 (1999-10-01), None
patent: 2001-244372 (2001-09-01), None
patent: 2003-209137 (2003-07-01), None
patent: WO00/55898 (2000-09-01), None

Affiliated with

Also associated with

Rating

Semiconductor device with external terminal joined to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with external terminal joined to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with external terminal joined to... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3887879