Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-10-23
2007-10-23
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23048, C257SE23061, C257SE23070, C257SE25023, C257S668000, C257S773000, C257S774000, C257S698000, C257S680000
Reexamination Certificate
active
11430375
ABSTRACT:
A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector on a peripheral edge of a semiconductor device that may be carried by the support structure. Optionally, the at least one conductive column may engage a feature of (e.g., a recess in) the peripherally disposed outer connector. The at least one conductive column may facilitate alignment of one or more semiconductor devices with the support substrate alignment of semiconductor devices relative to one another, or electrical connection between multiple semiconductor devices of other components.
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Jeung Boon Suan
Kwang Chua Swee
Loo Neo Yong
Poo Chia Yong
Waf Low Siu
TraskBritt PC
Williams Alexander Oscar
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