Polishing method, metallization fabrication method, method...

Details Polishing method, metallization fabrication method, method... Polishing method, metallization fabrication method, method...

2007-02-27

2007-02-27

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C257SE21230

Reexamination Certificate

active

10898252

ABSTRACT:
Described is a polishing technique adapted for multilevel metallization of an electronic circuit device, which comprises polishing a metal film with a polishing liquid containing an oxidizing substance, a phosphoric acid and a protection-layer forming agent. The present invention makes it possible to polishing a metal film at a high removal rate while suppressing occurrence of scratches, delamination, dishing or erosion.

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