Semiconductor component

Details Semiconductor component Semiconductor component

2007-02-20

2007-02-20

Schillinger, Laura M. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S737000, C257S738000

Reexamination Certificate

active

10492556

ABSTRACT:
A semiconductor component having electrode terminals14formed in rectangular planar shapes arranged in parallel on an electrode forming surface of a semiconductor chip and formed with rerouting patterns16electrically connected with the electrode terminals14through vias on the surface of an electrical insulating layer covering the electrode forming surface, characterized in that the planar arrangement of the via pads20formed on the surface of the electrical insulating layer is made an arrangement alternately offset to one side and the other side of the longitudinal direction of the electrode terminals14and in that rerouting patterns16are provided connected to the via pads20. The present invention enables easy formation of rerouting patterns even when the electrode terminals are arranged at fine intervals.

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patent: 6098278 (2000-08-01), Vindasius et al.
patent: 6150727 (2000-11-01), Takagi
patent: 6236112 (2001-05-01), Horiuchi et al.
patent: 2004/0238951 (2004-12-01), Kobayashi et al.
patent: 0 907 207 (1999-04-01), None
patent: 907207 (1999-04-01), None
patent: 5-29377 (1993-02-01), None
patent: WO 3034491 (2003-04-01), None

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