Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-10-02
2007-10-02
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
10836728
ABSTRACT:
Embodiments of the present invention disclose a transceiver module having a flexible circuit contained within a housing. The flexible circuit has various electronic components and either a photodiode or a laser transmitter disposed on and electrically connected to it. In alternate exemplary embodiments, both a photodiode and a laser are disposed on and connected to the flexible circuit. In addition, there can be electrical contacts disposed on and electrically connected to the flexible circuit. These electrical contacts can take the form of pads that are a standard form factor pluggable configuration, such as the Multisource Agreement Standard Form Factor Pluggable (MSA SFP) standard.
REFERENCES:
patent: 3271214 (1966-09-01), Tabor
patent: 3987676 (1976-10-01), Bennewitz
patent: 4092061 (1978-05-01), Stigliani, Jr.
patent: 4128697 (1978-12-01), Simpson
patent: 4375578 (1983-03-01), Mitchell et al.
patent: 4769684 (1988-09-01), Crocker et al.
patent: 4815990 (1989-03-01), Ristedt et al.
patent: 4818099 (1989-04-01), Preikschat et al.
patent: 4952016 (1990-08-01), Adams et al.
patent: 4953006 (1990-08-01), Kovats et al.
patent: 4962991 (1990-10-01), Carvalho
patent: 5125054 (1992-06-01), Ackley et al.
patent: 5136682 (1992-08-01), Moyer et al.
patent: 5212345 (1993-05-01), Gutierrez
patent: 5249245 (1993-09-01), Lebby et al.
patent: 5253311 (1993-10-01), Killen et al.
patent: 5299276 (1994-03-01), Okamura et al.
patent: 5359686 (1994-10-01), Galloway et al.
patent: 5361317 (1994-11-01), Hartman et al.
patent: 5371820 (1994-12-01), Welbourn et al.
patent: 5371822 (1994-12-01), Horwitz et al.
patent: 5375184 (1994-12-01), Sullivan
patent: 5389686 (1995-02-01), Diop et al.
patent: 5409384 (1995-04-01), Green et al.
patent: 5414786 (1995-05-01), Ohta et al.
patent: 5420954 (1995-05-01), Swirhun et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5432630 (1995-07-01), Lebby et al.
patent: 5452182 (1995-09-01), Eichelberger et al.
patent: 5471552 (1995-11-01), Wuu et al.
patent: 5495125 (1996-02-01), Uemura
patent: 5499312 (1996-03-01), Hahn et al.
patent: 5539848 (1996-07-01), Galloway
patent: 5545846 (1996-08-01), Williams et al.
patent: 5596662 (1997-01-01), Boscher
patent: 5613024 (1997-03-01), Shahid
patent: 5625734 (1997-04-01), Thomas et al.
patent: 5638469 (1997-06-01), Feldman et al.
patent: 5666449 (1997-09-01), Sawae et al.
patent: 5703895 (1997-12-01), Ghirardi et al.
patent: 5706378 (1998-01-01), Suzuki et al.
patent: 5717800 (1998-02-01), Funabashi
patent: 5774614 (1998-06-01), Gilliland et al.
patent: 5844783 (1998-12-01), Kojima
patent: 5894409 (1999-04-01), Tanaka
patent: RE36325 (1999-10-01), Corbett et al.
patent: 5974214 (1999-10-01), Shacklette et al.
patent: 5996222 (1999-12-01), Shangguan et al.
patent: 6011695 (2000-01-01), Dumke
patent: 6040624 (2000-03-01), Chambers et al.
patent: 6045269 (2000-04-01), Watanabe et al.
patent: 6069991 (2000-05-01), Hibbs-Brenner et al.
patent: 6088498 (2000-07-01), Hibbs-Brenner et al.
patent: 6091475 (2000-07-01), Ogino et al.
patent: 6118666 (2000-09-01), Aoki et al.
patent: 6195261 (2001-02-01), Babutzka et al.
patent: 6268231 (2001-07-01), Wetzel
patent: 6305848 (2001-10-01), Gregory
patent: 6326553 (2001-12-01), Yim et al.
patent: 6380493 (2002-04-01), Morita et al.
patent: 6404960 (2002-06-01), Hibbs-Brenner et al.
patent: 6473314 (2002-10-01), Custer et al.
patent: 6483712 (2002-11-01), Oliphant et al.
patent: 6485322 (2002-11-01), Branch et al.
patent: 6521989 (2003-02-01), Zhou
patent: 6586678 (2003-07-01), Rosenberg et al.
patent: 6617518 (2003-09-01), Ames et al.
patent: 6703561 (2004-03-01), Rosenberg et al.
patent: 6709607 (2004-03-01), Hibbs-Brenner et al.
patent: 6860649 (2005-03-01), Edwards et al.
patent: 6867377 (2005-03-01), Anderson et al.
patent: 2002/0170742 (2002-11-01), Liaw et al.
patent: 2003/0102157 (2003-06-01), Rosenberg et al.
patent: 2003/0197254 (2003-10-01), Huang
patent: 2004/0018409 (2004-01-01), Hui et al.
patent: 2004/0062491 (2004-04-01), Sato et al.
patent: 2004/0090620 (2004-05-01), Farr
patent: 2004/0092135 (2004-05-01), Hofmeister et al.
patent: 2004/0202214 (2004-10-01), Aronson et al.
patent: 2005/0045374 (2005-03-01), Kumar et al.
patent: 2005/0242160 (2005-11-01), Nippa et al.
patent: 2005/0244095 (2005-11-01), Ellison
patent: 2005/0245118 (2005-11-01), Liu et al.
patent: 2005/0265650 (2005-12-01), Priyadarshi et al.
patent: 2006/0062526 (2006-03-01), Ikeuchi
patent: 0 881 671 (1998-12-01), None
patent: 0 905 838 (1999-03-01), None
patent: 62-114545 (1987-05-01), None
patent: 03-0148190 (1991-06-01), None
patent: 406034838 (1994-02-01), None
patent: 407159636 (1995-06-01), None
patent: 09-223848 (1997-08-01), None
patent: 92/00538 (1992-01-01), None
U.S. Appl. No. 10/409,837, filed Apr. 9, 2003, Kumar et al.
U.S. Appl. No. 11/179,223, filed Jul. 11, 2005, Ice.
Murata, S., Nishimura, K.,Improvement in Thermal Properties of a Multi-Beam Laser Diode Array, Japanese Journal of Applied Physics, vol. 28, Suppl. 28-3, pp. 165-170 (1989).
Ali, “New Materials and Design Components for Integrated Optics,” Technology Report/Fiberoptics, Laser Focus World, vol. 21, No. 8, Aug. 1985, Tulsa, U.S., pp. 48 and 50.
Cohen, “Passive Laser-Fiber Alignment by Index Method,” IEEE Photonics Technology Letters, vol. 3, No. 11, Dec. 1991, pp. 985-987, New York, U.S.
Coldren, et al., “Flip-Chip Bonded, Back-Emitting, Microlensed Arrays of Monolithic Vertical Cavity Lasers and Resonant Photodetectors,” Electronic Components and Technology Conference, Sep. 1999, pp. 733-740.
Havant, “Flexible Interposing Carrier Scheme for Optical Waveguides,” Research Disclosure No. 303, Jul. 1989, p. 512.
Hibbs-Brenner, et al., “Packaging of VCSEL Arrays for Cost-Effective Interconnects at <10 Meters,” Electronic Components and Technology Conference, Sep. 1999, pp. 747-752.
Hsu, et al., “Flip-chip Approach to Endfire Coupling Between Single-Mode Optical Fibres and Channel Waveguides,” Patent Associated Literature, Electronics Letters, vol. 12, No. 16, pp. 404-405, Aug. 5, 1976.
Kazlas, et al., “Monolithic Vertical-Cavity Laser/p-i-n Photodiode Transceiver Array for Optical Interconnects,” IEEE Photonics Technology Letters, Nov. 1998, pp. 1530-1532, vol. 10, No. 11.
Louderback, et al., “Flip Chip Bonded Arrays of Monolithically Integrated, Microlensed Vertical-Cavity Lasers and Resonant Photodetectors,” IEEE Photonics Technology Letters, Mar. 1999, pp. 304-306, vol. II, No. 3.
Plawsky, et al., “Photochemically Machined, Glass Ceramic, Optical Fiber Interconnection Components,” Article, Optoelectronic Materials, Devices, Packaging and Interconnects (1988), SPIE, vol. 994, pp. 101-106.
Sullivan, et al., “Polymeric Waveguides,” 1992 IEEE, pp. 27-31.
Finisar Corporation
Prasad Chandrika
Workman Nydegger
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