Methods for packaging a plurality of semiconductor dice...

Details Methods for packaging a plurality of semiconductor dice... Methods for packaging a plurality of semiconductor dice...

2007-06-26

2007-06-26

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S709000

Reexamination Certificate

active

10934109

ABSTRACT:
A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.

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