De-packaging process for small outline transistor packages

Details De-packaging process for small outline transistor packages De-packaging process for small outline transistor packages

2007-10-09

2007-10-09

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Repair or restoration

C438S014000

Reexamination Certificate

active

11189487

ABSTRACT:
A method to de-packaging a semiconductor device to access and test the die within the package. The method involves initially removing molding compound from a first surface of the package to expose the underlying die attach pad of the package. A mask is then formed over the die attach-pad. An etching solution is subsequently introduced through an opening in the mask to etch away the die attach pad. Once the etching is complete, the die attach film is removed. An ohmic contact is then formed on the exposed back surface of the die. The ohmic contact is used to ground the die so that the electrical circuitry on the device will operate properly. Once grounded, the circuitry on the die can be electrically tested and debugged.

REFERENCES:
patent: 6150718 (2000-11-01), Livengood et al.
patent: 6309899 (2001-10-01), Mahanpour et al.
patent: 6329212 (2001-12-01), Dobrovolski
patent: 6429028 (2002-08-01), Young et al.
patent: 6813828 (2004-11-01), Dlugokecki et al.
patent: 6884663 (2005-04-01), Dlugokecki et al.
patent: 6917011 (2005-07-01), Hong et al.
patent: 7063987 (2006-06-01), Rowe et al.
patent: 2002/0048825 (2002-04-01), Young et al.

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