Recording medium having resin substrate

Details Recording medium having resin substrate Recording medium having resin substrate

2007-06-26

2007-06-26

Wellington, Andrea (Department: 2627)

Dynamic information storage or retrieval

Storage medium structure

Optical track structure

C369S283000

Reexamination Certificate

active

10358819

ABSTRACT:
A recording medium including a resin substrate having a first thermal expansion coefficient, a center hole, a first surface, and a second surface opposite to the first surface, a recording layer formed on the first surface of the resin substrate and having a recording region, an inner nonrecording region formed inside the inner periphery of the recording region, and an outer nonrecording region formed outside the outer periphery of the recording region, and a protective layer formed on the second surface of the resin substrate except an inner peripheral region having a predetermined range from the center hole, the recording region, and the outer nonrecording region. The thermal deformation suppressing layer has a second thermal expansion coefficient smaller than the first thermal expansion coefficient.

REFERENCES:
patent: 5118541 (1992-06-01), Yamamoto et al.
patent: 5878022 (1999-03-01), Okada et al.
patent: 6037099 (2000-03-01), Oogo et al.
patent: 6383595 (2002-05-01), Hirotsune et al.
patent: 6657948 (2003-12-01), Tajima et al.
patent: 04-307440 (1992-10-01), None
patent: 08-031011 (1996-02-01), None
patent: 11-016211 (1999-01-01), None
patent: 2000-003524 (2000-01-01), None

Affiliated with

Also associated with

Rating

Recording medium having resin substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Recording medium having resin substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Recording medium having resin substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3878166