Electronic part-mounted substrate, thermal conductive member...

Details Electronic part-mounted substrate, thermal conductive member... Electronic part-mounted substrate, thermal conductive member...

Filed on

2007-10-23

Date issued

2007-10-23

Examiner

Duverne, J. F. (Department: 2839)

Patent Class

Electricity: electrical systems and devices

SubClass

Housing or mounting assemblies with diverse electrical...

SubSubClass

For electronic systems and devices

Type

Reexamination Certificate

Status

active

Patent number

11261141

Description

ABSTRACT:
An electronic part-mounted substrate includes a plate made of metal, an insulating material layer which is formed of a ceramic material on a surface of the plate and which has a surface provided with a heat generating IC thereon, and a thermal conductive member which is provided on a surface of IC. The heat, which is generated by IC, is transmitted via the thermal conductive member to the insulating material layer and the plate, and the heat is dissipated to the outside. The heat generated by the electronic part can be dissipated more efficiently. The substrate is applicable to a liquid-jetting head.

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