Polyimide/metal laminate, and electric/electronic equipment...

Details Polyimide/metal laminate, and electric/electronic equipment... Polyimide/metal laminate, and electric/electronic equipment...

2007-02-20

2007-02-20

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S473500, C174S258000, C174S259000, C524S115000, C524S127000, C524S128000, C524S140000, C524S141000, C524S148000, C524S166000

Reexamination Certificate

active

10438907

ABSTRACT:
Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, moreover, can sustain the adhesive strength at a high ratio after exposure to high temperature or high temperature and high humidity. Owing to these characteristics, these polyimide/metal laminates are appropriately usable in flexible print wiring boards, multi-layered print wiring boards, rigid flex wiring boards, tapes for TAP, semiconductor packages such as CFOs and multi chip modules (MCMs), magnetic recording films, coating films for aerospace materials and filmy resistance elements.

REFERENCES:
patent: 4742099 (1988-05-01), Nagano et al.
patent: 4886874 (1989-12-01), Nagano et al.
patent: 5130192 (1992-07-01), Takabayashi et al.
patent: 6207739 (2001-03-01), Ono et al.
patent: 6350844 (2002-02-01), Ono et al.
patent: 6475624 (2002-11-01), Nishinaka et al.

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