Refrigeration – Processes – Treating an article
Reexamination Certificate
2007-11-20
2007-11-20
Ali, Mohammad M. (Department: 3744)
Refrigeration
Processes
Treating an article
C062S089000, C062S259200, C165S104330
Reexamination Certificate
active
11001795
ABSTRACT:
Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
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Bhardwaj et al. “High-Throughput Inductively coupled Plasma Production Platform for Etching Air- Bearing Surfaces on GMR Read/Write Heads” Datatech, Edition 1, pp. 131ff.
Chen Pei
Goitia Jorge
Hwang Cherngye
Leung Bigal
Perez Diana
Ali Mohammad M.
Hitachi Global Storage Technologies Amsterdam B.V.
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