Electronic component, semiconductor device, methods of...

Details Electronic component, semiconductor device, methods of... Electronic component, semiconductor device, methods of...

2007-06-26

2007-06-26

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S758000, C257S773000, C257SE23043, C257SE23047, C257SE23045

Reexamination Certificate

active

10331510

ABSTRACT:
The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relieving layer (16) provided on the semiconductor chip (12), and a stress transmission portion (22) for transmitting stress from the solder ball (20) to the stress relieving layer (16) in a peripheral position of an electrical connection portion (24a) of the solder ball (20) and wiring (18).

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