Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2007-02-13
2007-02-13
Doan, Theresa T. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S738000
Reexamination Certificate
active
11113908
ABSTRACT:
A surface, which is opposite to a plane polygon of a resin layer, includes a third side opposed to a first side of the plane polygon, and a fourth side oppose to a second side of the plane polygon. A first space between the first side and third side is narrower than a second space between the second side and fourth side. A plurality of electrodes are arranged in a first region located between the second side and the fourth side and are spaced apart from a second region located between the first side and the third side. The third side comprises a first curved line and a pair of second curved lines connected to both ends of the first curved line. The first curved line is convexly bent toward the inside of the resin layer and each of the second curved lines is convexly bent toward the outside of the resin layer.
REFERENCES:
patent: 6501169 (2002-12-01), Aoki et al.
patent: 7061127 (2006-06-01), Hashimoto
patent: 2003-282790 (2003-10-01), None
Doan Theresa T.
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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