Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-08-28
2007-08-28
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S719000, C361S814000
Reexamination Certificate
active
11006106
ABSTRACT:
A first substrate is fixed to a case. A heat-generating component is placed so as to be in contact with a radiator. A second substrate is mounted with the heat-generating component, and the second substrate is connected with the first substrate. The second substrate is put between the case and the radiator so as to be interposed and insulate between them. The first substrate and the second substrate comprise an assembly-guiding structure for assembling the second substrate and the first substrate at a certain assembly position. The assembly-guiding structure is composed of the first substrate defining a projection and the second substrate defining an opening. The amount of heat transfer from the radiator to the case is reduced.
REFERENCES:
patent: 2964621 (1960-12-01), Foltyn
patent: 4872102 (1989-10-01), Getter
patent: 5689403 (1997-11-01), Robertson et al.
patent: 6778388 (2004-08-01), Minelli
patent: 2001-111272 (2001-04-01), None
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
Thompson Gregory D
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